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IRIS Manufacturing
IRIS integrated manufacturing facility is fully equipped with state-of-the-art
machinery to produce a complete range of security and smart products
in both contact and contactless smart applications. For customer
convenience and security, processes relating to a wide range of
industries, from basic injection moulding and printing to integrated
circuit packaging, are performed within the IRIS Smart Complex.
Module Assembly
Performed within a clean-room environment, the processes are similar
to the packaging of conventional Integrated Circuits (IC's) with
the exception that the base material is in the form of a 35mm Gold-plated
tape. Processes include Wafer Dicing, Die attach, Wire Bonding,
Encapsulation/Transfer Moulding and chip testing.
Card Production
This range include all the items that are physically manufactured
by IRIS. This encompasses ISO standard cards made with plastic raw
material (injected or laminated).
- Card bodies
- Module for Contact Cards
- Embedding and Personalisation Services
- Phone Cards
- Contactless Memory Cards
- Contact or Contactless Microprocessor Card
To cater for the needs of various sectors IRIS has complete card
production facilities specially designed for single card or sheet
Printing, Injection Moulding, Card Laminating, Card Punching, Tape
Laying, Hot Stamping, Tape Laminating and other auxiliary services.
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